JPH0333078Y2 - - Google Patents

Info

Publication number
JPH0333078Y2
JPH0333078Y2 JP1981141282U JP14128281U JPH0333078Y2 JP H0333078 Y2 JPH0333078 Y2 JP H0333078Y2 JP 1981141282 U JP1981141282 U JP 1981141282U JP 14128281 U JP14128281 U JP 14128281U JP H0333078 Y2 JPH0333078 Y2 JP H0333078Y2
Authority
JP
Japan
Prior art keywords
connection terminal
heat sink
capacitor
semiconductor chip
rectifier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981141282U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5844855U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981141282U priority Critical patent/JPS5844855U/ja
Priority to US06/418,176 priority patent/US4489374A/en
Priority to DE8282108711T priority patent/DE3271391D1/de
Priority to EP82108711A priority patent/EP0075320B1/en
Publication of JPS5844855U publication Critical patent/JPS5844855U/ja
Application granted granted Critical
Publication of JPH0333078Y2 publication Critical patent/JPH0333078Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331—Disposition
    • H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181—On opposite sides of the body

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Rectifiers (AREA)
JP1981141282U 1981-09-21 1981-09-21 整流素子 Granted JPS5844855U (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1981141282U JPS5844855U (ja) 1981-09-21 1981-09-21 整流素子
US06/418,176 US4489374A (en) 1981-09-21 1982-09-14 Rectifying apparatus for automotive A.C. generator
DE8282108711T DE3271391D1 (en) 1981-09-21 1982-09-21 Rectifying apparatus for automotive a.c. generator
EP82108711A EP0075320B1 (en) 1981-09-21 1982-09-21 Rectifying apparatus for automotive a.c. generator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981141282U JPS5844855U (ja) 1981-09-21 1981-09-21 整流素子

Publications (2)

Publication Number Publication Date
JPS5844855U JPS5844855U (ja) 1983-03-25
JPH0333078Y2 true JPH0333078Y2 (en]) 1991-07-12

Family

ID=29934392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981141282U Granted JPS5844855U (ja) 1981-09-21 1981-09-21 整流素子

Country Status (1)

Country Link
JP (1) JPS5844855U (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015231306A (ja) * 2014-06-06 2015-12-21 トヨタ自動車株式会社 非接触受電装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS529532Y2 (en]) * 1971-06-23 1977-02-28
US4288912A (en) * 1978-09-11 1981-09-15 Varo Semiconductor, Inc. Method of constructing and processing a diode capacitor assembly

Also Published As

Publication number Publication date
JPS5844855U (ja) 1983-03-25

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